| abstract |
Properties of cleaning formulations for copper metallized substrates, useful compositions for post chemical physical polishing cleaning, and the like are improved. Compositions useful in microelectronic device manufacture for surface preparation and / or cleaning of wafer substrates such as microelectronic device precursor structures. The composition must be further processed to include copper metallization, for example, in operations such as surface preparation of microelectronic device wafers, pre-coating cleaning, post-etching cleaning and post-chemical mechanical polishing cleaning. Or for the processing of wafers that are intended to be further processed. The composition contains (i) an alkanolamine, (ii) a quaternary ammonium hydroxide, and (iii) a complexing agent, which not only exhibits darkness and deterioration resistance under exposure to oxygen, but also has stable storage properties. is there. [Selection figure] None |