| abstract |
An electronic device capable of further improving the adhesion reliability in a configuration in which gold or an alloy thereof is used for wiring, and an electronic device manufacturing method are provided. A drive substrate (pressure chamber substrate 29 and vibration plate 31) on which a piezoelectric element 32 and electrode wirings 44 and 45 for driving the piezoelectric element are formed, and a sealing plate 33 bonded thereto are provided. In the electronic device 14 provided, the electrode wiring is a region including a portion in which a wiring metal including gold (Au) is formed on the driving substrate via an adhesion layer 50 as a base layer and bonded to the bonding resin 43. A part of the wiring metal is removed to have a removed portion 49 where the adhesion layer is exposed. [Selection] Figure 3 |