| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e1bf06f55de84b78abc9a057807f7eb |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D183-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2016-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a2840ee1093ff4bf08dc2b52eb0c4a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a20e829f5b7414ced87fe75711632976
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c46b37990eeff025d4baba8f1b6a88b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_616f19fc0797f765447538db219542eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb96a5fffbcc5ce6af4ad10c082ed791
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9766b979ad0dc322fbf43425586d1992
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_085fd38e00ce3427f8f97331d0c57fe7 |
| publicationDate |
2016-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016169373-A |
| titleOfInvention |
Polyimide solution for printed wiring board, method for manufacturing printed wiring board, and printed wiring board |
| abstract |
A PI solution capable of forming on a substrate surface a porous polyimide (hereinafter referred to as PI) film having fine pores having good adhesion to the substrate, and a printed wiring board on which the film is formed, and A manufacturing method thereof is provided. Provided is a printed circuit board having a low dielectric constant that can be applied in a high frequency region. A PI solution containing a good solvent and a poor solvent for PI, wherein the PI contains an oxyalkylene unit and / or a siloxane unit in the main chain. A method for producing a printed wiring board comprising a step of forming a porous PI film by applying the PI solution to a substrate surface and then drying. A printed wiring board having the following characteristics, in which a porous PI coating is laminated and integrated on the surface of a substrate. 1) The main chain of the PI contains an oxyalkylene unit and / or a siloxane unit. 2) The average pore diameter of the porous PI coating is 10 nm or more and 2000 nm or less. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11179914-B2 |
| priorityDate |
2015-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |