| abstract |
Provided is a solvent composition for dissolving and peeling a synthetic resin from a composite material containing the synthetic resin or a solid substrate to which the synthetic resin is attached. (A) 30% by mass to 95% by mass of an organic solvent selected from the group consisting of N-methyl-2-pyrrolidone, normal propyl bromide, γ-butyrolactone, monoethanolamine, diethanolamine, and triethanolamine; A synthetic resin solvent composition on a solid substrate, comprising (b) 0.5% by mass to 5.0% by mass of a basic inorganic compound, and (c) 4.5% by mass to 65% by mass of glycerin. object. [Selection figure] None |