http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016162778-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2015-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6977f5b4f1ebd8b6e4e03784dd60f304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c403aeb8534b229859c20d7a57c1b1b0 |
| publicationDate | 2016-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016162778-A |
| titleOfInvention | Electronic component joining method, and conductive composition and pretreatment agent used in the method |
| abstract | An electronic component joining method capable of improving the joining property while maintaining the insulation reliability and shelf life of a conductive composition. An electronic component joining method according to the present invention includes a step of applying a pretreatment agent (X) containing an active agent (X) to an electronic component 1, and (A) conductive particles and (B And a step of applying a conductive composition 4 containing a resin and a step of mounting the electronic component 1 on the substrate 2 and performing a reflow process. [Selection] Figure 1 |
| priorityDate | 2015-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 150.