http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016162510-A

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filingDate 2015-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94b61cd575a8be2e3b70681a9405edbc
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publicationDate 2016-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016162510-A
titleOfInvention Connection structure manufacturing method and connection structure
abstract A method of manufacturing a connection structure that provides excellent insulation and electrical conductivity. And a connection structure. A method of manufacturing a connection structure in which at least one of a first circuit member formed with a first terminal and a second circuit member formed with a second terminal is a flexible substrate. The first circuit member and the second circuit member are conductive particles having an average particle diameter of 0.5 to 1.8 times the total height of the first terminal 11 and the second terminal 11. The anisotropic conductive film containing 31 is interposed and pressure-bonded to obtain a connection structure in which the conductive particles 31 in the space portion between the first circuit member and the second circuit member are crushed. Thereby, the outstanding insulation and electroconductivity can be acquired. [Selection] Figure 1
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