| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_905122d8678a831c0f8af203f34145dc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-359
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0622 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B26-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-042 |
| filingDate |
2015-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a6c7aa6406236e9050aee2d665f82f8 |
| publicationDate |
2016-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016159313-A |
| titleOfInvention |
Laser processing apparatus, control program and control method for laser processing apparatus |
| abstract |
The present invention relates to a laser processing apparatus that processes a surface of an object to be processed by irradiating a laser beam, and provides a laser processing apparatus that can reduce a decrease in processing quality at a processing start portion due to laser light. In a laser processing system, a laser processing apparatus has a laser oscillation unit and a galvano scanner, and is connected to a laser controller, a power supply unit, and a PC. The surface of the workpiece W is processed by scanning the pulse laser L from the laser oscillation unit 12 with the galvano scanner 19. When processing on the workpiece W is started under the control of the laser controller 5 and the PC 7, a third current supply period Tc for supplying a third current to the pumping semiconductor laser unit 40 is started (S13). When the waiting period Ts has elapsed from the start of the supply period Tc, scanning by the galvano scanner 19 is started (S14). [Selection] Figure 5 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019013971-A |
| priorityDate |
2015-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |