titleOfInvention |
Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, and resin sheet, prepreg, laminate, metal substrate, wiring board and power semiconductor device using them |
abstract |
An epoxy resin composition capable of forming a cured body having high thermal conductivity, high insulation, and high peel strength from a metal foil, and a resin sheet, prepreg, laminate, metal substrate, and wiring board using the same. A power semiconductor device is provided. An epoxy containing an epoxy resin monomer represented by the formula (I), a curing agent containing a novolak resin obtained by novolacizing a divalent phenol compound, and a mixed filler of α-alumina and boron nitride. An epoxy resin composition, which is a resin composition, and the proportion of α-alumina volume is 50 to 90% by volume when the volume of all fillers is 100% by volume. [Selection figure] None |