http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016155947-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
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filingDate 2015-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13200c02b9f2555ea23402a27f921cc4
publicationDate 2016-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016155947-A
titleOfInvention Polyarylene ether resin, production method of polyarylene ether resin, curable resin material, cured product thereof, semiconductor sealing material, semiconductor device, prepreg, printed circuit board, buildup film, buildup board
abstract [PROBLEMS] To provide a polyarylene ether resin excellent in various physical properties such as heat resistance, flame retardancy, and dielectric properties in a cured product, a method for producing the same, a curable resin material and a cured product thereof, a semiconductor sealing material, a semiconductor device, a prepreg, and a printed circuit Provision of substrates, build-up films, and build-up substrates. At least one aromatic nucleus in a polyarylene ether structure (α) has a naphthalene skeleton, and at least one aromatic nucleus in the polyarylene ether structure (α) is on the aromatic nucleus. Possesses a structural moiety further having a hydrocarbon group, an alkoxy group, a hydroxyl group, and a side group containing an X atom on the aromatic moiety containing x and y in formula (1). Polyarylene ether resin. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018193469-A
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Total number of triples: 37.