| abstract |
Provided are a resin composition for a printed wiring board, a prepreg, a metal-clad laminate, and a printed wiring board, which are stable and excellent in glass transition temperature and dielectric properties, and can realize good drilling workability and moldability. To do. A resin component and an inorganic filler are contained. The resin component contains a prereacted product and a cyanate ester compound obtained by reacting polyphenylene ether with an epoxy compound having an epoxy group. The inorganic filler contains hydrophobic silica particles obtained by subjecting silica particles to surface treatment and molybdenum compound particles having a molybdenum compound in at least a surface layer portion. [Selection figure] None |