| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3f3715de490e1bb21776ddfd16835f6 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B37-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
2015-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26953016df1db18ffab2b02e91eb1d5e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a98cf929d890998beccd699d0f0f539
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf5abb2a2e7434d6c55bf200f385c86a |
| publicationDate |
2016-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016145128-A |
| titleOfInvention |
Copper bonded ceramic substrate |
| abstract |
Provided is a copper-bonded ceramic substrate using an alumina substrate that is excellent in heat dissipation. An alumina substrate having a thickness of 0.05 to 0.09 mm, an aluminum oxide content of 50% by mass or more, and a zirconium oxide conversion content of 5 to 48% by mass, and alumina A copper-bonded ceramic substrate 1 comprising a copper plate 3 diffusion-bonded to the substrate. [Selection] Figure 1 |
| priorityDate |
2015-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |