http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016135924-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-10 |
| filingDate | 2016-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcd4ebe84b512b21b72f31825013c335 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7172affc18f5090315af90b042a886ea |
| publicationDate | 2016-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016135924-A |
| titleOfInvention | Surface-treated copper foil, copper-clad laminate, printed wiring board manufacturing method, semiconductor package manufacturing method, and electronic device manufacturing method |
| abstract | [PROBLEMS] To eliminate the need for etching when removing a copper foil from a resin base material after bonding the resin base material to the copper foil, without impairing the profile of the copper foil surface transferred to the surface of the resin base material. A surface-treated copper foil capable of removing a copper foil at a good cost is provided. A surface-treated copper foil does not have roughened particles, and has a surface roughness with a surface roughness of Rz of 0.1 to 5.0 μm measured according to JIS B0601 (1994); A release layer provided on the surface of the copper foil having surface irregularities, and the release layer that allows the resin substrate to be peeled when the resin substrate is bonded to the copper foil from the release layer side. A surface-treated copper foil with a step of attaching a resin base material to the surface-treated copper foil from the release layer side, and peeling the surface-treated copper foil from the resin base material without etching And a step of obtaining a resin base material having a copper foil surface profile transferred to the release surface, or a method of transferring a copper foil surface profile to a resin base material. [Selection] Figure 1 |
| priorityDate | 2016-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 401.