| abstract |
[PROBLEMS] To improve the reliability and productivity of a semiconductor device by suppressing generation of resin burrs in a molding process. In a mold, a tip surface of a push-up pin UP provided on the back surface side of a lower mold cavity block CVa and a surface of the back surface of the lower mold cavity block CVa with which the tip surface of the push-up pin UP contacts, The pot block PB to which the mold resin is supplied is inclined so that the distance from the surface of the lower mold cavity block CVa becomes longer toward the pot PO side. As a result, when the lower mold cavity block CVa is returned to the initial position, the lower mold cavity block CVa moves up slightly while moving to the pot block PB side, so that the side surface of the pot block PB and the side surface of the lower mold cavity block CVa No gap is formed between them. [Selection] Figure 2 |