http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016127011-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
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filingDate 2015-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7359dcd6db0ac1ce4b9c3784bab5a42b
publicationDate 2016-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016127011-A
titleOfInvention Conductive film, connection structure, and manufacturing method of connection structure
abstract Provided is a conductive film that can efficiently arrange solder particles on electrodes even if it is a conductive film instead of a conductive paste, and can improve conduction reliability between the electrodes. A conductive film according to the present invention includes a thermosetting compound and a thermosetting agent as thermosetting components and a plurality of solder particles, and the thermosetting compound has a weight average molecular weight of 5000 or more and 50000. The solder particles include the following thermosetting compound and a crystalline thermosetting compound, and the solder particles are particles in which both the central portion and the conductive outer surface are solder. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021125692-A
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priorityDate 2014-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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