http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016127011-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-00 |
filingDate | 2015-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7359dcd6db0ac1ce4b9c3784bab5a42b |
publicationDate | 2016-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2016127011-A |
titleOfInvention | Conductive film, connection structure, and manufacturing method of connection structure |
abstract | Provided is a conductive film that can efficiently arrange solder particles on electrodes even if it is a conductive film instead of a conductive paste, and can improve conduction reliability between the electrodes. A conductive film according to the present invention includes a thermosetting compound and a thermosetting agent as thermosetting components and a plurality of solder particles, and the thermosetting compound has a weight average molecular weight of 5000 or more and 50000. The solder particles include the following thermosetting compound and a crystalline thermosetting compound, and the solder particles are particles in which both the central portion and the conductive outer surface are solder. [Selection] Figure 1 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021125692-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017045542-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021157490-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017066188-A |
priorityDate | 2014-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.