| abstract |
A glass plate suitable for supporting a processed substrate used for high-density wiring and having high end face strength, and a method for manufacturing the same. An entire or part of an end surface of a glass plate formed by an overflow down draw method is formed by melting and solidifying a surface by laser irradiation, and all or a part of the surface is a polished surface, and an overall thickness deviation is 2 A method of manufacturing a glass plate 11 having an outer shape of less than 0.0 μm, a warpage amount of 60 μm or less, and a Young's modulus of 65 GPa or more. [Selection] Figure 3 |