| abstract |
The present invention provides a resin composition for adhering a semiconductor having high adhesive strength to PPF, low stress and excellent workability, and a highly reliable semiconductor device. A resin composition for semiconductor bonding includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a filler, and (E) -N = CSS. The organic compound which has a structural unit represented by these is contained. A semiconductor device is formed by bonding a semiconductor element onto a support member with such a composition. [Selection figure] None |