http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016115713-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d93502a23a72b56472bc75854cfe7c60
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 2014-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cde4bf92ab07a956095a52777229d3f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_924e06d20783adb26d76abd981c5e042
publicationDate 2016-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016115713-A
titleOfInvention Manufacturing method of multilayer printed wiring board
abstract A multilayer printed wiring board having an electrical insulating layer excellent in flatness and having an embedded wiring is manufactured. A step of forming a first curable resin composition layer on a conductor layer side surface of an inner layer substrate, and curing the first curable resin composition layer to form a substrate side portion of an electrical insulating layer Including a step of forming, a step of laminating the second curable resin composition layer, and a step of curing the second curable resin composition layer to form a surface side portion of the electrical insulating layer. The step of forming the curable resin composition layer includes a step of applying the layer forming composition on the surface of the inner layer substrate on the conductor layer side, and the step of laminating the second curable resin composition layer includes: A multilayer printed wiring comprising a step of laminating a second curable resin composition layer formed on a support on the first curable resin composition layer or a cured product of the first curable resin composition layer A manufacturing method of a board. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7342433-B2
priorityDate 2014-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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