http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016102247-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
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filingDate 2014-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06ea7b1f8f00c73b822d4024f8836836
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publicationDate 2016-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016102247-A
titleOfInvention Electrolytic copper plating solution for flexible wiring board and method for producing laminate using the electrolytic copper plating solution
abstract Disclosed is an electrolytic copper plating solution that is excellent in smoothness of a plated surface and can form a copper film that does not warp in a concave shape on the surface side of the plating over time. Electricity for flexible wiring boards comprising copper sulfate 60 g / L or more and 120 g / L or less, sulfuric acid 120 g / L or more and 240 g / L or less, chlorine 30 mg / L or more and 100 mg / L or less, and an additive. In the copper plating solution, the additive includes a disulfide compound of 1 mg / L to 50 mg / L, a nitrogen additive of 0.5 mg / L to 30 mg / L, and a polymer component of 2 g / L to 50 g / L. The copper film formed by the electrolytic copper plating solution containing L or less and sodium mercaptopropane sulfonate 0.1 mg / L or more and 10 mg / L or less has uniform smoothness with less unevenness and less warpage . [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7343280-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020132920-A
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