| abstract |
Provided is a panel in which a conductive part such as a circuit is integrally provided. A conductive portion is formed in a panel including a panel body made of synthetic resin having a front surface and a rear surface, and a frame-shaped portion made of synthetic resin provided at a peripheral edge of the rear surface of the panel body. The formed insert molded body 4 is integrated with at least one of the panel main body 2 and the frame-shaped portion 3, and the conductive portion of the insert molded body 4 is formed by an LDS (laser direct structuring) method. [Selection] Figure 1 |