| abstract |
A conductive adhesive for electronic parts having high adhesiveness, good conductivity, low ESR of a capacitor, and reduced raw material cost, and such a conductive adhesive We provide high performance and high reliability capacitors. The conductive adhesive for electronic components includes (A) an epoxy resin, (B) a phenol resin curing agent, (C) a flaky silver-coated copper powder, (D) a dendritic silver-coated copper powder, and (E ) Contains a curing accelerator. The total content of the component (C) and the component (D) is 70 to 85% by mass of the entire adhesive, and the mass ratio of the content of the component (C) and the component (D) is 95: 5 to 45:55. It is. [Selection figure] None |