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filingDate 2014-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a97bc56cea2a91fce35cc25cd13f67d3
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publicationDate 2016-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016081563-A
titleOfInvention Self-bonding insulated wire, coil wire and winding bundle
abstract An object of the present invention is to provide a self-bonding insulated wire having high reliability of fusion between wires and high insulation after fusion. A self-bonding insulated wire according to an aspect of the present invention includes a linear metal conductor, an insulating layer laminated on the outer peripheral surface side of the metal conductor, and a laminated layer on the outer peripheral surface side of the insulating layer. A self-bonding insulated wire comprising a heat-fusible layer that expands by heating, wherein the heat-fusible layer comprises a matrix mainly composed of a synthetic resin and a chemical foaming agent dispersed in the matrix or The heat-expandable microcapsule has an average thickness expansion coefficient after heating of the heat-fusible layer of 1.1 to 5 times. The elastic modulus of the matrix of the thermal fusion layer at the foaming start temperature of the chemical foaming agent or the thermally expandable microcapsule is preferably 1 kPa or more. The content of the chemical foaming agent or the thermally expandable microcapsule in the heat fusion layer is preferably 1% by mass or more and 15% by mass or less. [Selection] Figure 1
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priorityDate 2014-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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