| abstract |
Provided is a conductive resin composition for bonding electronic parts, which is a conductive paste that has high adhesion to a metal plating frame and is less likely to cause bleeding. SOLUTION: (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a fluorine-based dispersant, (E) a conductive powder are essential components, and (B) the curing agent is a phenol resin. Yes, (D) 0.1 to 1.5 parts by weight of the fluorine-based dispersant is included with respect to 100 parts by weight of the (A) epoxy resin, and (D) the fluorine-based dispersant is a fluorine-containing group / hydrophilic group. A conductive resin composition for bonding electronic parts, which is a lipophilic group-containing oligomer or a fluorine-containing / lipophilic group-containing oligomer. [Selection figure] None |