http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016079219-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0444efde206a2f829562761e58b7e1e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3477 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05 |
| filingDate | 2014-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a40ad37ea94f88af365458ce1c09163c |
| publicationDate | 2016-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016079219-A |
| titleOfInvention | Curable resin composition, cured product thereof, and semiconductor device |
| abstract | Provided is a curable resin composition that can be used as a sealant for a semiconductor element and can form a material having excellent barrier property against a corrosive gas by curing without causing a problem of solid precipitation. A polyorganosiloxane (A) having two or more alkenyl groups in the molecule, a polyorganosiloxane (B) having two or more hydrosilyl groups in the molecule, and represented by the following formula (1): A curable resin composition comprising an isocyanurate compound (C). (Ra to Rc are each independently a group having a glycidyl group or a polymerizable vinyl group) [Selection] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018235811-A1 |
| priorityDate | 2014-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 110.