http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016076557-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
filingDate 2014-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7359dcd6db0ac1ce4b9c3784bab5a42b
publicationDate 2016-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016076557-A
titleOfInvention Connection structure manufacturing method and connection structure
abstract A method of manufacturing a connection structure that can increase the manufacturing efficiency of the connection structure is provided. A method for manufacturing a connection structure according to the present invention includes a step of disposing a first conductive paste layer on one surface of a first connection target member and a second connection target member; A step of disposing one of the second connection target member and the first connection target member on the surface of the first conductive paste layer; and curing of the thermosetting component above the melting point of the solder particles. By heating the first conductive paste layer at a temperature higher than the temperature, the first connection portion connecting the first connection target member and the second connection target member is changed to the first conductive paste. The first conductor portion and the second conductor portion are electrically connected by the first solder portion derived from the solder particles, and the first solder portion is Embedding in the first via. [Selection] Figure 1
priorityDate 2014-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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