http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016076354-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-02 |
filingDate | 2014-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7359dcd6db0ac1ce4b9c3784bab5a42b |
publicationDate | 2016-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2016076354-A |
titleOfInvention | Connection structure manufacturing method and connection structure |
abstract | Provided is a method for manufacturing a connection structure, in which solder particles can be efficiently arranged between conductor portions and the conduction reliability between the conductor portions can be improved. A method for manufacturing a connection structure according to the present invention includes a step of disposing a first conductive paste layer on one surface of a first connection target member and a second connection target member; A step of disposing one of the second connection target member and the first connection target member on the surface of the first conductive paste layer; and curing of the thermosetting component above the melting point of the solder particles. By heating the first conductive paste layer at a temperature higher than the temperature, the first connection portion connecting the first connection target member and the second connection target member is changed to the first conductive paste. And a step of electrically connecting the first conductor portion and the second conductor portion with a first solder portion derived from the solder particles. [Selection] Figure 1 |
priorityDate | 2014-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.