http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016072661-A

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filingDate 2014-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82475467f0dafdad40b8b357553d5917
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publicationDate 2016-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016072661-A
titleOfInvention Ultrasonic transducer, manufacturing method thereof, ultrasonic transducer array and ultrasonic inspection apparatus
abstract The present invention provides a structure capable of suppressing warpage of a substrate on which a CMUT is formed and a method for manufacturing the same without affecting the film configuration optimized to maintain the characteristics of the CMUT and suppress distortion of the membrane. A substrate warpage prevention structure is provided in a region or position other than the membrane that determines the characteristics of the CMUT. As a warpage prevention structure, for example, in a CMUT having a structure in which a first conductive layer and a second conductive layer are provided on a substrate with a cavity interposed therebetween, warpage of the substrate is prevented between the substrate and the first conductive film. A warping prevention layer is provided. When the insulating film disposed between the cavity and the first conductive film and between the cavity and the second conductive film is a silicon oxide film, the warpage preventing layer includes a silicon nitride film. [Selection] Figure 3
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