http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016066615-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36 |
| filingDate | 2015-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7359dcd6db0ac1ce4b9c3784bab5a42b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52cca6a9292469f4ccf25facefa11b26 |
| publicationDate | 2016-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016066615-A |
| titleOfInvention | Conductive paste, connection structure, and manufacturing method of connection structure |
| abstract | Provided is a conductive paste capable of improving the reliability of conduction between electrodes. A conductive paste according to the present invention includes a thermosetting compound and a thermosetting agent as thermosetting components, and a plurality of solder particles, and the thermosetting compound comprises a crystalline phenol aralkyl epoxy compound. Including. [Selection] Figure 1 |
| priorityDate | 2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 71.