| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19b5c6093f8859d3e6bf9237df2eb5b |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
2014-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_206e264be9a2d54b3096dd493bdb89e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61b56fa39f9e5bda14df408ec27a07e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55b712e478693cfd32dee0492cded009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e4a1bd15e426cd0566691f47a400d01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5695181dff917e4776285dc620945eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3b060a10c591367b8547cd73b851831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df0b4c45d1114b2b9caf58f101a377a7 |
| publicationDate |
2016-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016058545-A |
| titleOfInvention |
Printed wiring board substrate, printed wiring board, and printed wiring board manufacturing method |
| abstract |
Provided is a printed wiring board substrate capable of sufficiently thinning a conductive layer at low cost. A printed wiring board substrate according to an aspect of the present invention includes a first base film laminated on at least one surface of the base film by applying an insulating base film and a conductive ink containing metal particles. A conductive layer and a second conductive layer laminated on the surface of the first conductive layer opposite to the base film by electroless plating, and nickel exists in the first conductive layer, the second conductive layer, and the base film And the nickel amount in the interface vicinity layer of 500 nm or less from the interface between the first conductive layer and the base film is 1% by mass or more as determined by EDX analysis. It is preferable that the mass ratio of nickel in the interface vicinity layer is larger than the mass ratio of nickel in the A layer of 500 nm or less from the interface between the second conductive layer and the first conductive layer. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111699760-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023189745-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023189744-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022270339-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017204371-A |
| priorityDate |
2014-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |