| abstract |
To improve the bonding reliability in flip chip bonding of a semiconductor device. A method for manufacturing a semiconductor device includes: a wiring connected to each of a plurality of electrode pads formed on a main surface of a semiconductor wafer; and a wiring that positions each of the plurality of electrode pads at different positions. A step of forming a Ni / Au film, a step of polishing the back surface of the semiconductor wafer, a step of reducing the surface of the Ni / Au film, and a step of forming solder bumps on the Ni / Au film. Have. In the reduction process, flux application, reflow, and cleaning processes are performed. After the reduction process is completed, solder bumps are bonded to the Ni / Au film. [Selection] Figure 8 |