| abstract |
The present invention provides an electronic device that is excellent in heat dissipation efficiency of a heat-generating component and that can suppress a local increase in the surface temperature of a storage body. An electronic device includes a housing, a circuit board, and a heat conductive sheet. A circuit board P is attached inside the housing 40. On the circuit board P, electronic components 51, 52, 53 are mounted, and metal cases 61, 62 are attached. The heat conductive sheet 101 includes first flat portions 111 and 112, a second flat portion 120, and connection portions 131 and 132. The heat conductive sheet 101 is deformed so that the first flat portions 111 and 112 protrude from the second flat portion 120 to the circuit board P side. The surface on the circuit board P side in the first flat portions 111 and 112 is bonded to the metal cases 61 and 62. In addition, the surface of the second flat portion 120 opposite to the circuit board P is bonded to the inner surface of the housing 40. [Selection] Figure 4 |