| abstract |
A highly reliable semiconductor chip heat sink and stiffener adhesive are provided. A liquid epoxy resin having a viscosity of 0.1 to 1,000 Pa · s at 25 ° C., including the following formula 1, a liquid phenolic curing agent having no siloxane bond having a viscosity of 0.1 to 100 Pa · s at 25 ° C., tetraphenyl Curing accelerator selected from phosphine, imidazole and tertiary amine, inorganic filler treated with silane coupling agent and having an average particle size of 0.1 μm or more, thermoplastic resin particles solid at 25 ° C., and average particle size A liquid epoxy resin composition having a viscosity of 50 to 1,000 Pa · s at 25 ° C., comprising silica treated with a silane coupling agent having a nonreactive functional group of 0.005 to 0.1 μm. (R is H, halogen, unsubstituted or substituted monovalent hydrocarbon group having 1 to 6 carbon atoms, alkoxy group or aryl group; they may be the same or different. I; 0 to 3 integers) [Selection] None |