http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016035463-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1543b2b19ec0e331a0dcd89888cbef5f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2015-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_276d584d322fc4b989486fca399660bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38be917940c91164663cf53c96f4577a |
| publicationDate | 2016-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016035463-A |
| titleOfInvention | IC device socket |
| abstract | There is provided a socket for an IC device having a structure that allows a plurality of types of power supply settings and / or ground settings to be easily performed without increasing the thickness of a substrate. An IC device socket includes at least one dielectric layer 22 arranged to form a C component in a base material 21, and power supply layers 222, 222 'and a GND layer 224 formed on both surfaces thereof. 224 ′. Each of the power supply layers 222 and 222 ′ and the GND layers 224 and 224 ′ is divided into two or more via an insulating region 290. [Selection] Figure 4 |
| priorityDate | 2015-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.