| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2014-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50b0dad22acb5b4f946ae89c8ba6ef11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b6c0844a3e945d890dbc2d54db463e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c2dc977877256c04baf5ea5299fbe6d |
| publicationDate |
2016-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016034997-A |
| titleOfInvention |
Epoxy resin composition, resin sheet, prepreg, metal-clad laminate, printed wiring board |
| abstract |
The present invention provides an epoxy resin composition for a resin substrate in which warpage occurring in a heating step in a substrate preparation step and / or a mounting step is suppressed. An epoxy resin composition comprising an epoxy resin represented by formula (1) and a cyanate ester compound having two or more cyanate groups in a molecule as essential components. (The ratio of (a) and (b) is (a) / (b) = 1-3; G is a glycidyl group; n is the number of repetitions and is 0-5.) [Selection] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019011481-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018070552-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018070553-A |
| priorityDate |
2014-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |