| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2305-77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-712
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-7265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2310-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d64b63476d31bcf19d0415c139d000fe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7281fa16f84185354db0094f109193f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b048780ce953657b76370c8430c2a37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a |
| publicationDate |
2016-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016033951-A |
| titleOfInvention |
Sealing material with supporting substrate, post-sealing semiconductor element mounting substrate, post-sealing semiconductor element forming wafer, semiconductor device, and manufacturing method of semiconductor device |
| abstract |
Even when a large-diameter wafer or a large-area substrate is sealed, warpage of the substrate or wafer and separation of the semiconductor element can be suppressed, and the semiconductor element mounting surface of the substrate or the semiconductor element formation surface of the wafer can be integrated. It can be sealed and has uniform and homogeneity without fiber opening and twisting, and it has excellent heat resistance, electrical insulation, moisture resistance, and other features, as well as extremely versatility and mass productivity. Provided is a sealing material with a supporting substrate that is excellent in economic efficiency. An encapsulant for collectively encapsulating a semiconductor element mounting surface of a substrate or a semiconductor element forming surface of a wafer, comprising: a support base material including a fiber film surface-treated with an organosilicon compound; The sealing material with a support base material which has a resin layer which consists of a thermosetting resin formed on the single side | surface. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7265723-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018037569-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017204558-A |
| priorityDate |
2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |