http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016033233-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 |
| filingDate | 2014-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f7afddf56ff25a8dd79657faf5fd675 |
| publicationDate | 2016-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016033233-A |
| titleOfInvention | Surface-treated copper powder for conductive paste and method for producing conductive paste using the same |
| abstract | Provided is a surface-treated copper powder for a conductive paste excellent in sintering delay. A surface-treated copper powder for a conductive paste containing at least one element selected from the group consisting of Al, Si, Ti, Zr, Ce and Sn attached to the surface of the copper powder. The adhesion amount x (μg) of one or more elements selected from the group consisting of Al, Si, Ti, Zr, Ce and Sn to 1 g of copper powder, and the sintering start temperature y (° C.) are as follows: The base material to which the conductive paste comprising the copper powder subjected to the surface treatment satisfying the formula: 50 ≦ x ≦ 1500 and y ≧ 0.2x + 530 is a coating film containing ceramic particles or metal powder particles, When the average particle diameter D50cer of the ceramic particles or the average particle diameter D50met of the metal powder particles and the average particle diameter D50cu of the surface-treated copper powder are expressed by the following formula: 0 .01 ≦ D50cu / D50met ≦ 1. The filled, when the coating film contains no metallic powder particles have the formula: satisfy 0.01 ≦ D50cu / D50cer ≦ 1.0, the surface-treated copper powder for a conductive paste. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020111799-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7064684-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113348045-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I740290-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11565312-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210107829-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018125433-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020144931-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102471934-B1 |
| priorityDate | 2014-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 129.