http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016032051-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-37147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-40225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2014-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b1551ab70a049684e4ece1f08bb51d8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_091559234106a41ace41307dc2f6bdd4 |
| publicationDate | 2016-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016032051-A |
| titleOfInvention | Joining material, electronic component, electrical product and joining method |
| abstract | To improve long-term bonding reliability in a bonding portion between a bonding layer made of a sintered layer of copper and an electrode formed of Au or another metal. In a bonding material containing cupric oxide, a copper salt hydrate, and a solvent, the thermal decomposition temperature of the copper salt hydrate is lower than the reduction temperature of cupric oxide. The electronic component includes two electrodes and a bonding layer that is electrically connected therebetween, and the bonding layer includes a layer obtained by sintering copper, and at least one of the two electrodes includes: It shall have the area | region where copper diffused from the interface with a joining layer. The bonding method is to apply a bonding material containing cupric oxide, a hydrate of copper salt, and a solvent to the bonding portion, and to thermally decompose the copper salt, thereby heating the cupric oxide. To form a bonding layer. [Selection] Figure 12 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018168185-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11569169-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017057645-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112017000940-T5 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112018001566-T5 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10340154-B2 |
| priorityDate | 2014-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 115.