| abstract |
An object of the present invention is to provide a semiconductor package that reduces heat transfer from a lower chip to an upper chip in a stacked semiconductor package. A stacked semiconductor package according to an embodiment of the present invention includes a first semiconductor package including a first circuit board, a first semiconductor element mounted on the first circuit board, and a second semiconductor package. A second semiconductor package including a second semiconductor element mounted on the circuit board and the second circuit board and stacked on the first semiconductor package; and on the first semiconductor element and around the first semiconductor element A heat conductive material disposed on the first circuit board. [Selection] Figure 1 |