http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016011428-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2015-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a597117db59c3dc0e9b487f92c2380d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ad99a2ec5e1246f81073533d694b6d2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4b9f8d5260ab980ad1a17f3cbe15ec9 |
| publicationDate | 2016-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016011428-A |
| titleOfInvention | Epoxy resin molding material for sealing, and electronic component device provided with element sealed with this molding material |
| abstract | An epoxy resin molding material for sealing that has high adhesion to a metal at high temperatures and excellent reflow resistance, and an electronic component device including an element sealed thereby. (A) An epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent, and (C) a monovalent or divalent phenol containing one or more nitrile groups in a molecular structure. An epoxy resin molding material for sealing containing a derivative. (C) The ratio of the monovalent or divalent phenol derivative having one or more nitrile groups in the molecular structure is preferably 0.1 to 1.0% by mass. Furthermore, it is preferable to contain (D) a silane compound, (E) a curing accelerator, and (F) an inorganic filler. It is an electronic component device provided with the element sealed with the said epoxy resin molding material for sealing. [Selection figure] None |
| priorityDate | 2010-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 309.