abstract |
A granular resin composition for compression molding, which is a sealing material that is suitable for compression molding and has excellent adhesion to a semiconductor element and has good moldability, and a resin-encapsulated semiconductor device using the same To provide. A sealing resin composition containing (A) an epoxy resin, (B) a phenol curing agent, (C) a curing accelerator, (D) spherical silica, and (E) a coumarone-based resin as essential components. The (C) curing accelerator contains (c1) an imidazole curing accelerator and (c2) a phosphorus curing accelerator, and (D) spherical silica is 75 to 95 on the basis of the total amount of the resin composition. It is a resin-encapsulated semiconductor device formed by encapsulating a semiconductor element using the powdery resin composition for compression molding and the resin composition, characterized by containing by mass%. [Selection figure] None |