| abstract |
PROBLEM TO BE SOLVED: To provide an insulating resin composition which is halogen-free and has a low dielectric constant, excellent dielectric properties, heat resistance and connection reliability, and a prepreg and a printed wiring board laminate using the same. A maleimide compound (A) having an N-substituted maleimide group in a molecule, an epoxy resin (B) having at least two epoxy groups in one molecule, an aromatic vinyl compound, and maleic anhydride A copolymer resin (C) containing as a component, and a high molecular weight polyphenylene ether resin (D) having a number average molecular weight of 80000 to 120,000 obtained by polycondensation of one or more monocyclic phenols, (C) The component molar ratio of the component copolymer resin when the component derived from the aromatic vinyl compound represented by the general formula (1) is m and the component derived from maleic anhydride is n is m: n = 7: 1 to 9: 1, and (A) component is 15 to 65 parts by mass, (B) component is 15 to 50 parts by mass, and (C) component is 15 to 40 parts by mass with respect to 100 parts by mass of the organic resin solid content. Part, (D) Insulating resin composition whose component is 5-10 mass parts. [Selection figure] None |