http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016004961-A

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filingDate 2014-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86d038c1668e50a05371a5b39149d484
publicationDate 2016-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016004961-A
titleOfInvention Imaging device and manufacturing method thereof
abstract In an imaging device including a waveguide, surface roughness of an insulating film covering a seal ring portion is prevented. A pixel region PE, a peripheral circuit region PC, and a seal ring region SR are defined on a semiconductor substrate SUB. After the pad electrode PD is formed in the peripheral circuit region PC and the seal ring SRPD is formed in the seal ring region SR, the TEOS film TE2 is formed so as to cover the pad electrode PD and the seal ring SRPD. A photoresist pattern is formed to expose portions of the TEOS film TE2 that respectively cover the pad electrode PD and the seal ring SRPD, and the exposed TEOS film TE2 is etched. Next, after the pattern of the photoresist RP12 is formed, an etching process is performed to form the second waveguide opening WGH2 in the pixel region PE. [Selection] Figure 43
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Total number of triples: 27.