| abstract |
Provided is a lead-free solder paste using an Sn-Bi alloy, which can solve the above-mentioned problems such as poor solder wetting and generation of solder balls. A non-halogen-based flux comprising a rosin base resin (A) containing a polymerized rosin (a1), a dibasic acid activator (B) and an ethylene oxide adduct (C) of cyclohexylamine as essential components, In addition, a lead-free solder paste characterized by being made of Sn-Bi solder alloy powder is used. [Selection figure] None |