| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2033-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2033-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2033-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-34 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L53-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-0001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14065 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L53-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate |
2013-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015536371-A |
| titleOfInvention |
Molding and overmold compositions for electronic devices |
| abstract |
The present invention relates to molding and overmold compositions for delicate parts. More particularly, the present invention relates to compositions for low pressure molding and overmolding, and these compositions are particularly adapted to electronic devices. The molding and overmold compositions are suitable for low pressure injection molding processes, in particular injection molding processes at 70 ° C. to 240 ° C., 0.5 to 200 bar. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021038392-A |
| priorityDate |
2012-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |