| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0545 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76892
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K15-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21V19-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-44 |
| filingDate |
2013-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015532533-A |
| titleOfInvention |
Electrical component and method and system for manufacturing electrical component |
| abstract |
The method of manufacturing the electrical component (100) includes providing a substrate (104), applying an insulating layer (110) on the substrate, and applying a circuit layer (112) on the insulating layer. And irradiating the insulating layer with an electron beam (114) to change the insulating layer, and irradiating the circuit layer with an electron beam to change the circuit layer. The substrate can be a metal substrate having high thermal conductivity. The insulating layer performs electrical separation and effective heat transfer between the circuit layer and the substrate. The method may include the step of coupling a light emitting diode module (102) or other active circuit that requires thermal management to the circuit layer present on the electrically insulating or thermally conductive layer. |
| priorityDate |
2012-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |