| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823871
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-30 |
| filingDate |
2013-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015529981-A |
| titleOfInvention |
Etching composition |
| abstract |
An aqueous metal etching composition and process for selective etching of nickel platinum during semiconductor device manufacture. About 60% to about 95% of at least one sulfonic acid; about 0.005% to about 0.04% chloride anion; about 0.03% to about 0.27% bromide anion; An etching composition comprising 1% to about 20% nitrate or nitrosyl ions; and about 3% to about 37% water. [Selection] Figure 1 |
| priorityDate |
2012-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |