| abstract |
Ink compositions and circuit boards and methods for their production are provided. The ink composition contains an acrylic resin, an epoxy resin, a polyester resin, a curing agent, and an active powder containing a modified metal compound, and the metal elements of the modified metal compound are Zn, Cr, Co, It is selected from the group consisting of Cu, Mn, Mo, Ni and combinations thereof. [Selection figure] None |