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filingDate 2013-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2015-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015523716-A
titleOfInvention Method for manufacturing semiconductor device and method for using chemical mechanical polishing composition
abstract A method of manufacturing a semiconductor device, comprising subjecting a III-V material to chemical mechanical polishing (CMP) under a CMP composition containing a specific nonionic surfactant. A chemical mechanical polishing composition comprising (A) inorganic particles, organic particles or a mixture or composite thereof, (B) at least one amphiphilic nonionic surfactant, and (M) an aqueous medium. A method for manufacturing a semiconductor device in which a layer or a substrate containing at least one III-V material is subjected to chemical mechanical polishing in the presence of an object, wherein the amphiphilic nonionic surfactant is (b1) at least one type It has a hydrophobic group and (b2) at least one hydrophilic group selected from the group consisting of polyalkylene groups, and the polyoxyalkylene group contains (b22) oxyalkylene monomers other than oxyethylene units.
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type http://data.epo.org/linked-data/def/patent/Publication

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