| abstract |
According to certain embodiments, a light emitting diode, ie, a semiconductor die (210), is embedded in a polymer binder (420, 230) that includes a phosphor in certain embodiments, for example, an independent white light emitting die and A composite wafer is formed that includes a plurality of light emitting dies embedded in a single volume of binder (420, 230). In certain embodiment methods, the contacts of the semiconductor die (210) remain at least partially uncoated by the binder, or the die separates after the binder (420, 230) has been applied. It is exposed again to the surroundings before being done. |