http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015224378-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2b86357fa6e8b130b3e17c7f8e56856f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F11-00 |
| filingDate | 2014-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71b5142e481747d814a6d1e3dc394816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91a4c263c076369d6cafffc97f4f91ff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef199939ba48096435bd8965662296a9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8df0c3a6e22c15a6373bb765d1c1a354 |
| publicationDate | 2015-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015224378-A |
| titleOfInvention | Metal surface treatment agent and use thereof |
| abstract | PROBLEM TO BE SOLVED: To provide a chemical film excellent in heat resistance and solder wettability on a metal surface constituting a circuit portion of a printed wiring board when an electronic component or the like is bonded to the printed wiring board using solder. An object of the present invention is to provide a surface treatment agent, a surface treatment method, a printed wiring board, and a soldering method that improve the solderability by forming. A metal surface treatment agent containing an imidazole compound having a (meth) acryloyl group. By irradiating the chemical conversion film derived from the imidazole compound with active energy rays such as ultraviolet rays, control of the properties of the chemical conversion film is expected. [Selection figure] None |
| priorityDate | 2014-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 204.