| abstract |
PROBLEM TO BE SOLVED: To provide a polishing liquid capable of improving flatness after polishing and a method for polishing a substrate using the polishing liquid. A polishing liquid for CMP containing cerium oxide particles, a polymer compound, and water. The cerium oxide particles have an average aspect ratio that indicates the ratio of the long side to the short side of the particles, and is 1.5. Polishing liquid which is particle | grains of -6.0, a high molecular compound is an acrylic acid polymer, and pH is 4.0 or more and 6.0 or less. The content of the cerium oxide particles is preferably 0.05 to 5.0% by mass with respect to the total mass of the polishing liquid. [Selection] Figure 1 |